Future Hi-Tech于2月27日宣布,已获得价值53.8亿韩元的高带宽存储器(HBM3e)测试设备追加订单。因此,Future Hi-Tech今年的累计订单积压量已达到144.8亿韩元。 此次追加订单正值人工智能(AI)半导体市场快速增长以及 HBM 需求激增的背景下。该公司表示,Future Hi-Tech ...
Quantum technologies and materials, which promise to have a huge impact on research and the future of high-tech industries in ...
Il 16 e 17 ottobre al Polo Papardo Unime (ingresso gratuito) il meeting che sarà inaugurato dal ministro Musumeci. Il Talent ...